Texwipe CMP Cleaning System
TexPure Industrial Cleaning Wipers re-hydrate oxide slurry deposits for easy removal from CMP tools and surrounding surfaces.*
* Chemical mechanical polishing (CMP) is a slurry-based process commonly used to planarize or polish thin film surfaces to enable stacking of additional levels to enhance lithographic patterning of wafers. After several nano-processing steps (e.g., photolithography, deposition, etc.), it is used to make surfaces atomically smooth and is also an interim step in IC and data storage disk and media manufacturing.
For additional information on Texwipe's TexPure product line, please refer to the following PDF documents, or contact Dalatec.